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Nová generace procesorů pro mobilní zařízení a stolní počítače přináší vyšší rychlost a výkon, lepší odezvu, ohromující vestavěné vizuální prvky a zcela nové nástroje pro zabezpečení, zvýšení produktivity a efektivní správu ve firmách.
Procesory 3. generace Intel® Core™ mohou díky novým 3D tranzistorům Intel Tri-Gate a 22nm technologii procesorů nabídnout rychlejší, inteligentnější a efektivnější výpočetní a multimediální výkon.
* Až o 12 % rychlejší při typickém pracovním zatížení ve srovnání s procesory 2. generace Intel® Core™1
* Až o 10 % rychlejší procesor a celkově lepší výkon díky nové 22nm architektuře
* Až o 50 % lepší tepelný výkon ve srovnání s procesory 2. generace Intel® Core™
Specifikace CPU:
* Processor Number i5-3450
* # of Cores 4
* # of Threads 4
* Clock Speed 3.1 GHz
* Max Turbo Frequency 3.5 GHz
* Intel® Smart Cache 6 MB
* Bus/Core Ratio 31
* DMI 5 GT/s
* Instruction Set 64-bit
* Instruction Set Extensions SSE4.1/4.2, AVX
* Lithography 22 nm
* Max TDP 77 W
Specifikace pamětí:
* Max Memory Size (dependent on memory type) 32 GB
* Memory Types DDR3-1333/1600
* # of Memory Channels 2
* Max Memory Bandwidth 25.6 GB/s
* ECC Memory Supported No
Specifikace grafiky:
* Processor Graphics Intel® HD Graphics 2500
* Graphics Base Frequency 650 MHz
* Graphics Max Dynamic Frequency 1.1 GHz
* Intel® Quick Sync Video Yes
* Intel® InTru™ 3D Technology Yes
* Intel® Insider™ Yes
* Intel® Wireless Display Yes
* Intel® Flexible Display Interface (Intel® FDI) Yes
* Intel® Clear Video HD Technology Yes
Více informací naleznete zde:
http://ark.intel.com/products/65511/Intel-Core-i5-3450-Processor-(6M-Cache-up-to-3_50-GHz)
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Nová generace procesorů pro mobilní zařízení a stolní počítače přináší vyšší rychlost a výkon, lepší odezvu, ohromující vestavěné vizuální prvky a zcela nové nástroje pro zabezpečení, zvýšení produktivity a efektivní správu ve firmách.
Procesory 3. generace Intel® Core™ mohou díky novým 3D tranzistorům Intel Tri-Gate a 22nm technologii procesorů nabídnout rychlejší, inteligentnější a efektivnější výpočetní a multimediální výkon.
* Až o 12 % rychlejší při typickém pracovním zatížení ve srovnání s procesory 2. generace Intel® Core™1
* Až o 10 % rychlejší procesor a celkově lepší výkon díky nové 22nm architektuře
* Až o 50 % lepší tepelný výkon ve srovnání s procesory 2. generace Intel® Core™
Specifikace CPU:
* Processor Number i5-3570K
* K označuje odemknutý násobič
* # of Cores 4
* # of Threads 4
* Clock Speed 3.4 GHz
* Max Turbo Frequency 3.8 GHz
* Intel® Smart Cache 6 MB
* Bus/Core Ratio 34
* DMI 5 GT/s
* Instruction Set 64-bit
* Instruction Set Extensions SSE4.1/4.2, AVX
* Lithography 22 nm
* Max TDP 77 W
Specifikace pamětí:
* Max Memory Size (dependent on memory type) 32 GB
* Memory Types DDR3-1333/1600
* # of Memory Channels 2
* Max Memory Bandwidth 25.6 GB/s
* ECC Memory Supported No
Specifikace grafiky:
* Processor Graphics Intel® HD Graphics 4000
* Graphics Base Frequency 650 MHz
* Graphics Max Dynamic Frequency 1.15 GHz
* Intel® Quick Sync Video Yes
* Intel® InTru™ 3D Technology Yes
* Intel® Insider™ Yes
* Intel® Wireless Display Yes
* Intel® Flexible Display Interface (Intel® FDI) Yes
* Intel® Clear Video HD Technology Yes
Více informací naleznete zde:
http://ark.intel.com/products/65520/Intel-Core-i5-3570K-Processor-(6M-Cache-up-to-3_80-GHz)
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Nová generace procesorů pro mobilní zařízení a stolní počítače přináší vyšší rychlost a výkon, lepší odezvu, ohromující vestavěné vizuální prvky a zcela nové nástroje pro zabezpečení, zvýšení produktivity a efektivní správu ve firmách.
Procesory 3. generace Intel® Core™ mohou díky novým 3D tranzistorům Intel Tri-Gate a 22nm technologii procesorů nabídnout rychlejší, inteligentnější a efektivnější výpočetní a multimediální výkon.
* Až o 12 % rychlejší při typickém pracovním zatížení ve srovnání s procesory 2. generace Intel® Core™1
* Až o 10 % rychlejší procesor a celkově lepší výkon díky nové 22nm architektuře
* Až o 50 % lepší tepelný výkon ve srovnání s procesory 2. generace Intel® Core™
Specifikace CPU:
* Processor Number i5-3550
* # of Cores 4
* # of Threads 4
* Clock Speed 3.3 GHz
* Max Turbo Frequency 3.7 GHz
* Intel® Smart Cache 6 MB
* Bus/Core Ratio 33
* DMI 5 GT/s
* Instruction Set 64-bit
* Instruction Set Extensions SSE4.1/4.2, AVX
* Lithography 22 nm
* Max TDP 77 W
Specifikace pamětí:
* Max Memory Size (dependent on memory type) 32 GB
* Memory Types DDR3-1333/1600
* # of Memory Channels 2
* Max Memory Bandwidth 25.6 GB/s
* ECC Memory Supported No
Specifikace grafiky:
* Processor Graphics Intel® HD Graphics 2500
* Graphics Base Frequency 650 MHz
* Graphics Max Dynamic Frequency 1.1 GHz
* Intel® Quick Sync Video Yes
* Intel® InTru™ 3D Technology Yes
* Intel® Insider™ Yes
* Intel® Wireless Display Yes
* Intel® Flexible Display Interface (Intel® FDI) Yes
* Intel® Clear Video HD Technology Yes
Více informací naleznete zde:
http://ark.intel.com/products/65516/Intel-Core-i5-3550-Processor-(6M-Cache-up-to-3_70-GHz)
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Nová generace procesorů pro mobilní zařízení a stolní počítače přináší vyšší rychlost a výkon, lepší odezvu, ohromující vestavěné vizuální prvky a zcela nové nástroje pro zabezpečení, zvýšení produktivity a efektivní správu ve firmách.
Procesory 3. generace Intel® Core™ mohou díky novým 3D tranzistorům Intel Tri-Gate a 22nm technologii procesorů nabídnout rychlejší, inteligentnější a efektivnější výpočetní a multimediální výkon.
* Až o 12 % rychlejší při typickém pracovním zatížení ve srovnání s procesory 2. generace Intel® Core™1
* Až o 10 % rychlejší procesor a celkově lepší výkon díky nové 22nm architektuře
* Až o 50 % lepší tepelný výkon ve srovnání s procesory 2. generace Intel® Core™
Specifikace CPU:
* Processor Number i5-3450S
* # of Cores 4
* # of Threads 4
* Clock Speed 2.8 GHz
* Max Turbo Frequency 3.5 GHz
* Intel® Smart Cache 6 MB
* Bus/Core Ratio 28
* DMI 5 GT/s
* Instruction Set 64-bit
* Instruction Set Extensions SSE4.1/4.2, AVX
* Lithography 22 nm
* Max TDP 65 W
Specifikace pamětí:
* Max Memory Size (dependent on memory type) 32 GB
* Memory Types DDR3-1333/1600
* # of Memory Channels 2
* Max Memory Bandwidth 25.6 GB/s
* ECC Memory Supported No
Specifikace grafiky:
* Processor Graphics Intel® HD Graphics 2500
* Graphics Base Frequency 650 MHz
* Graphics Max Dynamic Frequency 1.1 GHz
* Intel® Quick Sync Video Yes
* Intel® InTru™ 3D Technology Yes
* Intel® Insider™ Yes
* Intel® Wireless Display Yes
* Intel® Flexible Display Interface (Intel® FDI) Yes
* Intel® Clear Video HD Technology Yes
Více informací naleznete zde:
http://ark.intel.com/products/65512/Intel-Core-i5-3450S-Processor-(6M-Cache-up-to-3_50-GHz)
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Nová generace procesorů pro mobilní zařízení a stolní počítače přináší vyšší rychlost a výkon, lepší odezvu, ohromující vestavěné vizuální prvky a zcela nové nástroje pro zabezpečení, zvýšení produktivity a efektivní správu ve firmách.
Procesory 3. generace Intel® Core™ mohou díky novým 3D tranzistorům Intel Tri-Gate a 22nm technologii procesorů nabídnout rychlejší, inteligentnější a efektivnější výpočetní a multimediální výkon.
* Až o 12 % rychlejší při typickém pracovním zatížení ve srovnání s procesory 2. generace Intel® Core™1
* Až o 10 % rychlejší procesor a celkově lepší výkon díky nové 22nm architektuře
* Až o 50 % lepší tepelný výkon ve srovnání s procesory 2. generace Intel® Core™
Specifikace CPU:
* Processor Number i7-3770
* # of Cores 4
* # of Threads 8
* Clock Speed 3.4 GHz
* Max Turbo Frequency 3.9 GHz
* Intel® Smart Cache 8 MB
* Bus/Core Ratio 34
* DMI 5 GT/s
* Instruction Set 64-bit
* Instruction Set Extensions SSE4.1/4.2, AVX
* Lithography 22 nm
* Max TDP 77 W
Specifikace pamětí:
* Max Memory Size (dependent on memory type) 32 GB
* Memory Types DDR3-1333/1600
* # of Memory Channels 2
* Max Memory Bandwidth 25.6 GB/s
* ECC Memory Supported No
Specifikace grafiky:
* Processor Graphics Intel® HD Graphics 4000
* Graphics Base Frequency 650 MHz
* Graphics Max Dynamic Frequency 1.15 GHz
* Intel® Quick Sync Video Yes
* Intel® InTru™ 3D Technology Yes
* Intel® Insider™ Yes
* Intel® Wireless Display Yes
* Intel® Flexible Display Interface (Intel® FDI) Yes
* Intel® Clear Video HD Technology Yes
Více informací naleznete zde:
http://ark.intel.com/products/65719/Intel-Core-i7-3770-Processor-(8M-Cache-up-to-3_90-GHz)
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CPU Type: CPU Desktop
CPU: A4-3300
CPU Clock Rate: 2.5 GHz
CPU Core Quantity: 2
CPU Core Name: Llano
CPU Socket Standard: Socket FM1
Integrated Memory Controller Type: Two DDR3 Channels
CPU Features: AMD Virtualization Technology
AMD Dual Graphics
Processor Chip Packaging Type: mPGA
Die Size: 32 nm
Stepping: B0
IGP
IGP Name: AMD Radeon HD 6410D, DDR3 1600, AMD Dual Graphics)
Stream Processors Quantity: 160
Cache Memory
L2 Cache Size: 2 x 512 KB
Environment
TDP: 65 W
CPU Core Voltage Max: 1.412 V
Miscellaneous
CPU Package Type: box
CPU Cooling Method: Cooling Fan
Nominal Weight: 0.01 kg
Warranty
Warranty Products returnable: Yes
Warranty Term (month): 36 month
Warranty validation Criteria: Serial Number
Logistic
Pack Weight Brutto (kg): 0.3 kg
Pieces in pack: 1
Packs in Box: 10
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Originální P/N ADX250USCK23GQ Název produktu AMD Athlon II X2 250, socket AM3, 1.6 GHz, 2MB cache, 25W, Tray Výrobce AMD Třída produktu
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General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
Intel Core i5
Model number ?
i5-2450P
CPU part numbers
CM8062301157300 is an OEM/tray microprocessor BX80623I52450P is a boxed microprocessor
Frequency ?
3200 MHz
Turbo frequency
3500 MHz
Bus speed ?
5 GT/s DMI
Clock multiplier ?
32
Package
1155-land Flip-Chip Land Grid Array
Socket
Socket 1155 (Socket H2)
Size
1.48" x 1.48" / 3.75cm x 3.75cm
S-spec numbers
Production processors
Part number
SR0G1
BX80623I52450P
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CM8062301157300
+
Architecture / Microarchitecture
Microarchitecture
Sandy Bridge
Processor core ?
Sandy Bridge
Core stepping ?
D2 (SR0G1)
Manufacturing process
0.032 micron High-K metal gate process
Data width
64 bit
The number of cores
4
The number of threads
4
Floating Point Unit
Integrated
Level 1 cache size ?
4 x 32 KB instruction caches 4 x 32 KB data caches
Level 2 cache size ?
4 x 256 KB
Level 3 cache size
6 MB shared cache
Physical memory
32 GB
Multiprocessing
Uniprocessor
Features
MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
AES instructions
Advanced Vector Extensions
Extended Memory 64 technology (EM64T) ?
Execute disable bit ?
Turbo Boost technology 2.0
Virtualization technology (VT-x) ?
Low power features
Enhanced SpeedStep technology ?
On-chip peripherals
Dual-channel DDR3 memory controller
Direct Media Interface
PCI Express 2.0 interface
Electrical/Thermal parameters
Maximum operating temperature ?
72.6°C
Thermal Design Power ?
95 Watt
Notes on Intel CM8062301157300
This model does not include on-chip GPU
Memory controller supports DDR3-1066 and DDR3-1333 memory
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General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
Intel Core i5
Model number ?
i5-2380P
CPU part numbers
CM8062301157400 is an OEM/tray microprocessor BX80623I52380P is a boxed processor (English version) BXC80623I52380P is a boxed processor (Chinese version)
Frequency ?
3100 MHz
Turbo frequency
3400 MHz
Bus speed ?
5 GT/s DMI
Clock multiplier ?
31
Package
1155-land Flip-Chip Land Grid Array
Socket
Socket 1155 (Socket H2)
Size
1.48" x 1.48" / 3.75cm x 3.75cm
S-spec numbers
Production processors
Part number
SR0G2
BX80623I52380P
+
BXC80623I52380P
+
CM8062301157400
+
Architecture / Microarchitecture
Microarchitecture
Sandy Bridge
Processor core ?
Sandy Bridge
Core stepping ?
D2 (SR0G2)
Manufacturing process
0.032 micron High-K metal gate process
Data width
64 bit
The number of cores
4
The number of threads
4
Floating Point Unit
Integrated
Level 1 cache size ?
4 x 32 KB instruction caches 4 x 32 KB data caches
Level 2 cache size ?
4 x 256 KB
Level 3 cache size
6 MB shared cache
Physical memory
32 GB
Multiprocessing
Uniprocessor
Features
MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
AES instructions
Advanced Vector Extensions
Extended Memory 64 technology (EM64T) ?
Execute disable bit ?
Turbo Boost technology 2.0
Virtualization technology (VT-x) ?
Low power features
Enhanced SpeedStep technology ?
On-chip peripherals
Dual-channel DDR3 memory controller
Direct Media Interface
PCI Express 2.0 interface
Electrical/Thermal parameters
Maximum operating temperature ?
72.6°C
Thermal Design Power ?
95 Watt
Notes on Intel CM8062301157400
This model does not include on-chip GPU
Memory controller supports DDR3-1066 and DDR3-1333 memory
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General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
Intel Core i5
Model number ?
i5-2550K
CPU part numbers
CM8062301213000 is an OEM/tray microprocessor BX80623I52550K is a boxed microprocessor
Frequency ?
3400 MHz
Turbo frequency
3800 MHz
Bus speed ?
5 GT/s DMI
Clock multiplier ?
34
Package
1155-land Flip-Chip Land Grid Array
Socket
Socket 1155 (Socket H2)
Size
1.48" x 1.48" / 3.75cm x 3.75cm
S-spec numbers
Production processors
Part number
SR0QH
BX80623I52550K
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CM8062301213000
+
Architecture / Microarchitecture
Microarchitecture
Sandy Bridge
Processor core ?
Sandy Bridge
Core stepping ?
D2 (SR0QH)
Manufacturing process
0.032 micron High-K metal gate process
Data width
64 bit
The number of cores
4
The number of threads
4
Floating Point Unit
Integrated
Level 1 cache size ?
4 x 32 KB instruction caches 4 x 32 KB data caches
Level 2 cache size ?
4 x 256 KB
Level 3 cache size
6 MB shared cache
Physical memory
32 GB
Multiprocessing
Uniprocessor
Features
MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
AES instructions
Advanced Vector Extensions
Extended Memory 64 technology (EM64T) ?
Execute disable bit ?
Turbo Boost technology 2.0
Virtualization technology (VT-x) ?
Low power features
Enhanced SpeedStep technology ?
On-chip peripherals
Dual-channel DDR3 memory controller
Direct Media Interface
PCI Express 2.0 interface
Electrical/Thermal parameters
Maximum operating temperature ?
72.6°C
Thermal Design Power ?
95 Watt
Notes on Intel CM8062301213000
The processor has unlocked clock multiplier
This model does not include on-chip GPU
Memory controller supports DDR3-1066 and DDR3-1333 memory
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* balení neobsahuje chladič
* Processor Number - i7-3960X
* # of Cores - 6
* # of Threads - 12
* Clock Speed - 3.3 GHz
* Max Turbo Frequency - 3.9 GHz
* Intel® Smart Cache - 15 MB
* # of QPI Links - 1
* Instruction Set - 64-bit
* Integrated Graphics - No
* Max TDP - 130 W
* VID Voltage Range - 0.6V-1.35V
* ECC Memory Supported - No
* Sockets Supported - FCLGA2011
* Intel® Turbo Boost Technology - Yes
* Intel® Hyper-Threading Technology - Yes
* Intel® Virtualization Technology (VT-x) - Yes
* Intel® Virtualization Technology for Directed I/O (VT-d) - Yes
* AES New Instructions - Yes
* Intel® 64 - Yes
* Enhanced Intel SpeedStep® Technology - Yes
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Essentials -
Status - Launched
Launch Date - Q4'11
Processor Number - i7-2700K
# of Cores - 4
# of Threads - 8
Clock Speed - 3.5 GHz
Max Turbo Frequency - 3.9 GHz
Intel® Smart Cache - 8 MB
Bus/Core Ratio - 35
DMI - 5 GT/s
Instruction Set - 64-bit
Instruction Set Extensions - SSE4.1/4.2, AVX
Embedded Options Available - ne
Lithography - 32 nm
Max TDP - 95 W
Recommended Customer Price - $332 - $342
Max Memory Size (dependent on memory type) - 32 GB
Memory Types - DDR3-1066/1333
# of Memory Channels - 2
Max Memory Bandwidth - 21 GB/s
ECC Memory Supported - ne
Processor Graphics - Intel® HD Graphics 3000
Graphics Base Frequency - 850 MHz
Graphics Max Dynamic Frequency - 1.35 GHz
Intel® Quick Sync Video - ano
Intel® InTru™ 3D Technology - ano
Intel® Insider™ - ano
Intel® Wireless Display - ne
Intel® Flexible Display Interface (Intel® FDI) - ano
Intel® Clear Video HD Technology - ano
Dual Display Capable - ano
PCI Express Revision - 2
# of PCI Express Ports - 1
Max CPU Configuration - 1
TCASE - 72.6°C
Package Size - 37.5mm x 37.5mm
Sockets Supported - LGA1155
Low Halogen Options Available - ano
Intel® Turbo Boost Technology - 2
Intel® vPro Technology - ne
Intel® Hyper-Threading Technology - ano
Intel® Virtualization Technology (VT-x) - ano
Intel® Virtualization Technology for Directed I/O (VT-d) - ne
Intel® Trusted Execution Technology - ne
AES New Instructions - ano
Intel® 64 - ano
Idle States - ano
Enhanced Intel® SpeedStep® Technology - ano
Thermal Monitoring Technologies - ano
Intel® Fast Memory Access - ano
Intel® Flex Memory Access - ano
Execute Disable Bit - ano
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AMD Athlon II X4 651 Black Edition- 4 jádra- 3,0 GHz- 4MB cache- socket FM1- 100W- bez grafického jádra
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AMD A4-3300 rev- 2 jádra- 2,5 GHz- 3 MB cache- socket FM1- 65W- VGA HD6410D
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AMD Athlon II X4 641- 4 jádra- 2,8 GHz- 4MB cache- socket FM1- 100W- bez grafického jádra
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AMD A4-3400 rev- 2 jádra- 2,7 GHz- 3 MB cache- socket FM1- 65W- VGA HD6410D
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CPU Type: CPU Desktop
CPU: FX-6100
CPU Clock Rate: 3.3 GHz
CPU Core Quantity: 6
CPU Core Name: Zambezi
CPU Socket Standard: Socket AM3+
CPU Bus Speed: 3.2 GHz
CPU Bus: HT 3.1
Integrated Memory Controller Type: Two DDR3 Channels
CPU Features: AMD Virtualization Technology
AMD Turbo Core
Processor Chip Packaging Type: OPGA
Die Size: 32 nm
Stepping: B2
Cache Memory
L2 Cache Size: 6 x 1 MB
L3 Cache Size: 8 MB
Environment
TDP: 95 W
Miscellaneous
CPU Package Type: box
CPU Cooling Method: Cooling Fan
Nominal Weight: 0.01 kg
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CPU Type: CPU Desktop
CPU: FX-4170
CPU Clock Rate: 4.2 GHz
CPU Core Quantity: 4
CPU Core Name: Zambezi
CPU Socket Standard: Socket AM3+
CPU Bus: HT 3.1
Integrated Memory Controller Type: Four DDR3 Channels
CPU Features: AMD Virtualization Technology
AMD Turbo Core
Processor Chip Packaging Type: OPGA
Die Size: 32 nm
Stepping: B2
Cache Memory
L2 Cache Size: 4 MB
L3 Cache Size: 8 MB
Environment
TDP: 125 W
CPU Core Voltage Max: 1.475 V
Miscellaneous
CPU Package Type: box
CPU Cooling Method: Cooling Fan
Nominal Weight: 0.01 kg
Warranty
Warranty Products returnable: Yes
Warranty Term (month): 36 month
Warranty validation Criteria: Serial Number
Logistic
Pack Weight Brutto (kg): 0.3 kg
Pieces in pack: 1
Packs in Box: 10
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CPU Core Name: Sandy Bridge-E
Processor Number i7-3930K
# of Cores 6
# of Threads 12
Clock Speed 3.2 GHz
Max Turbo Frequency 3.8 GHz
Intel® Smart Cache 12 MB
Instruction Set 64-bit
Embedded Options Available No
Max TDP 130 W
Memory Specifications: ECC Memory Supported No
Graphics Specifications:Integrated Graphics
Package Specifications
Sockets Supported FCLGA2011
Low Halogen Options Available Yes
Advanced Technologies
Intel® Turbo Boost Technology Yes
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
AES New Instructions Yes
Intel® 64 Yes
Enhanced Intel SpeedStep® Technology Yes
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AMD partnering with Asetek to do an 8-Core FX liquid cooling PIB at launch
Liquid cooling kit retails alone for more than $120
Allows Overclock of the FX 8-Core CPU to 700-800MHz above stock clock frequencies
CPU Type: CPU Desktop
CPU: FX-8150
CPU Clock Rate: 3.6 GHz
CPU Core Quantity: 8
CPU Core Name: Zambezi
CPU Socket Standard: Socket AM3+
CPU Bus Speed: 3.2 GHz
CPU Bus: HT 3.1
Integrated Memory Controller Type: Two DDR3 Channels
CPU Features: AMD Turbo Core
AMD Virtualization Technology
Processor Chip Packaging Type: OPGA
Die Size: 32 nm
Stepping: B2
Cache Memory
L2 Cache Size: 8 x 1 MB
L3 Cache Size: 8 MB
Environment
TDP: 125 W
Miscellaneous
CPU Package Type: box
CPU Cooling Method: Cooling Fan
Nominal Weight: 0.01 kg
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General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
Intel Celeron Dual-Core
Model number ?
G460
CPU part numbers
CM8062301088702 is an OEM/tray microprocessor BX80623G460 is a boxed processor (English version) BXC80623G460 is a boxed processor (Chinese version)
Frequency (MHz) ?
1800
Bus speed (MHz) ?
5 GT/s DMI
Clock multiplier ?
18
Package
1155-land Flip-Chip Land Grid Array
Socket
Socket 1155 (Socket H2)
Size
1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date
December 11, 2011
S-spec numbers
Production processors
Part number
SR0GR
BX80623G460
+
BXC80623G460
+
CM8062301088702
+
Architecture / Microarchitecture
Microarchitecture
Sandy Bridge
Processor core ?
Sandy Bridge
Manufacturing process
0.032 micron High-K metal gate process
Data width
64 bit
Number of cores
1
Floating Point Unit
Integrated
Level 1 cache size ?
32 KB instruction cache 32 KB data cache
Level 2 cache size ?
256 KB
Level 3 cache size
1.5 MB
Physical memory (GB)
32
Multiprocessing
Uniprocessor
Features
MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
Extended Memory 64 technology (EM64T) ?
Execute disable bit ?
Virtualization technology (VT-x) ?
HyperThreading technology ?
Low power features
Enhanced SpeedStep technology ?
On-chip peripherals
Dual-channel DDR3 memory controller
Direct Media Interface
PCI Express 2.0 interface
HD graphics controller
Electrical/Thermal parameters
Maximum operating temperature (°C) ?
65.5
Thermal Design Power (W) ?
35
Notes on Intel CM8062301088702
Integrated graphics controller runs at 650 MHz, and up to 1000 MHz in Turbo mode
Memory controller supports DDR3-1066 memory
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AMD A6-3870- 4 jádra- 3,0 GHz- 4 MB cache- socket FM1- 100W- VGA HD6550D
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AMD A6-3670- 4 jádra- 2,7 GHz- 4 MB cache- socket FM1- 100W- VGA HD6530D
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AMD Athlon II X4 651- 4 jádra- 3,0 GHz- 4MB cache- socket FM1- 100W- bez grafického jádra
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General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
Intel Core i3
Model number ?
i3-2120T
CPU part numbers
CM8062301046008 is an OEM/tray microprocessor BX80623I32120T is a boxed processor (English version) BXC80623I32120T is a boxed processor (Chinese version)
Frequency (MHz) ?
2600
Bus speed (MHz) ?
5 GT/s DMI
Clock multiplier ?
26
Package
1155-land Flip-Chip Land Grid Array
Socket
Socket 1155 (Socket H2)
Size
1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date
September 4, 2011
S-spec numbers
Production processors
Part number
SR060
BX80623I32120T
+
CM8062301046008
+
Architecture / Microarchitecture
Microarchitecture
Sandy Bridge
Processor core ?
Sandy Bridge
Manufacturing process
0.032 micron High-K metal gate process
Data width
64 bit
Number of cores
2
Floating Point Unit
Integrated
Level 1 cache size ?
2 x 32 KB instruction caches 2 x 32 KB data caches
Level 2 cache size ?
2 x 256 KB
Level 3 cache size
3 MB shared cache
Physical memory (GB)
32
Multiprocessing
Uniprocessor
Features
MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
Advanced Vector Extensions
Extended Memory 64 technology (EM64T) ?
Execute disable bit ?
HyperThreading technology ?
Virtualization technology (VT-x) ?
Low power features
Enhanced SpeedStep technology ?
On-chip peripherals
Dual-channel DDR3 memory controller
Direct Media Interface
PCI Express 2.0 interface
HD 2000 graphics controller
Electrical/Thermal parameters
Maximum operating temperature (°C) ?
65
Thermal Design Power (W) ?
35
Notes on Intel CM8062301046008
Integrated graphics controller runs at 650 MHz, and up to 1100 MHz in Turbo mode
Memory controller supports DDR3-1066 and DDR3-1333 memory
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General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
Intel Celeron Dual-Core
Model number ?
G530
CPU part numbers
CM8062301046704 is an OEM/tray microprocessor BX80623G530 is a boxed processor (English version) BXC80623G530 is a boxed processor (Chinese version)
Frequency (MHz) ?
2400
Bus speed (MHz) ?
5 GT/s DMI
Clock multiplier ?
24
Package
1155-land Flip-Chip Land Grid Array
Socket
Socket 1155 (Socket H2)
Size
1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date
September 4, 2011
S-spec numbers
Production processors
Part number
SR05H
BX80623G530
+
BXC80623G530
+
CM8062301046704
+
Architecture / Microarchitecture
Microarchitecture
Sandy Bridge
Processor core ?
Sandy Bridge
Manufacturing process
0.032 micron High-K metal gate process
Data width
64 bit
Number of cores
2
Floating Point Unit
Integrated
Level 1 cache size ?
2 x 32 KB instruction caches 2 x 32 KB data caches
Level 2 cache size ?
2 x 256 KB
Level 3 cache size
Shared 2 MB
Physical memory (GB)
32
Multiprocessing
Uniprocessor
Features
MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
Extended Memory 64 technology (EM64T) ?
Execute disable bit ?
Virtualization technology (VT-x) ?
Low power features
Enhanced SpeedStep technology ?
On-chip peripherals
Dual-channel DDR3 memory controller
Direct Media Interface
PCI Express 2.0 interface
HD graphics controller
Electrical/Thermal parameters
Maximum operating temperature (°C) ?
69.1
Thermal Design Power (W) ?
65
Notes on Intel CM8062301046704
Integrated graphics controller runs at 850 MHz, and up to 1000 MHz in Turbo mode
Memory controller supports DDR3-1066 memory
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General information
Type
CPU / Microprocessor
Market segment
Desktop
Family
Intel Celeron Dual-Core
Model number ?
G540
CPU part numbers
CM8062301046804 is an OEM/tray microprocessor BX80623G540 is a boxed processor (English version) BXC80623G540 is a boxed processor (Chinese version)
Frequency (MHz) ?
2500
Bus speed (MHz) ?
5 GT/s DMI
Clock multiplier ?
25
Package
1155-land Flip-Chip Land Grid Array
Socket
Socket 1155 (Socket H2)
Size
1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date
September 4, 2011
S-spec numbers
Production processors
Part number
SR05J
BX80623G540
+
BXC80623G540
+
CM8062301046804
+
Architecture / Microarchitecture
Microarchitecture
Sandy Bridge
Processor core ?
Sandy Bridge
Manufacturing process
0.032 micron High-K metal gate process
Data width
64 bit
Number of cores
2
Floating Point Unit
Integrated
Level 1 cache size ?
2 x 32 KB instruction caches 2 x 32 KB data caches
Level 2 cache size ?
2 x 256 KB
Level 3 cache size
Shared 2 MB
Physical memory (GB)
32
Multiprocessing
Uniprocessor
Features
MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1 ?
SSE4.2 ?
Extended Memory 64 technology (EM64T) ?
Execute disable bit ?
Virtualization technology (VT-x) ?
Low power features
Enhanced SpeedStep technology ?
On-chip peripherals
Dual-channel DDR3 memory controller
Direct Media Interface
PCI Express 2.0 interface
HD graphics controller
Electrical/Thermal parameters
Maximum operating temperature (°C) ?
69.1
Thermal Design Power (W) ?
65
Notes on Intel CM8062301046804
Also available as an embedded microprocessor
Integrated graphics controller runs at 850 MHz, and up to 1000 MHz in Turbo mode
Memory controller supports DDR3-1066 memory
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Frequency (MHz)
3400
Turbo frequency (MHz)
3800
Package
1155-land Flip-Chip Land Grid Array
Socket
Socket H2 (LGA1155)
Architecture / Microarchitecture
Microarchitecture
Sandy Bridge
Manufacturing process
0.032 micron High-K metal gate process
Data width
64 bit
Number of cores
4
Floating Point Unit
Integrated
Level 1 cache size
4 x 32 KB instruction caches 2 x 32 KB data caches
Level 2 cache size
4 x 256 KB
Level 3 cache size
8 MB shared cache
Multiprocessing
Uniprocessor
Features
MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1
SSE4.2
AES instructions
Advanced Vector Extensions
Extended Memory 64 technology (EM64T)
Execute disable bit
HyperThreading technology
Virtualization technology
Turbo Boost technology
On-chip peripherals
Integrated DDR3 SDRAM Memory controller
Graphics controller
Electrical/Thermal parameters
Thermal Design Power (W)
95
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Originální P/N FD6100WMGUSBX Název produktu AMD FX-6100, socket AM3+, 64bit, 3,3GHz, 95W, cache 14MB, BOX Výrobce AMD Třída produktu Procesory Typ procesoru FX-Series (Socket AM3+) Kód procesoru FX-6100 Typ patice procesoru Socket AM3+ Taktovací frekvence procesoru 3.3 GHz Frekvence sběrnice FSB 2000 MHz Vyrovnávací paměť [L2 cache] 6 MB Vyrovnávací paměť [L3 cache] 8 MB Podpora technologie Hyper-Threading Ne Integrovaná grafika Ne Doplňující informace 6-jádrový procesor 95W 32nm Přiložený ventilátor Ano Další informace www.amd.com [LINK]
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