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Launch Date Q2'11
Processor Number E3-1220
# of Cores 4
# of Threads 4
Clock Speed 3.1 GHz
Max Turbo Frequency 3.4 GHz
Intel® Smart Cache 8 MB
Bus/Core Ratio 31
DMI 5 GT/s
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX
Embedded Options Available No
Lithography 32 nm
Max TDP 80 W
Memory Specifications
Max Memory Size
(dependent on memory type) 32 GB
Memory Types DDR3-1066/1333
# of Memory Channels 2
Max Memory Bandwidth 21 GB/s
ECC Memory Supported Yes
Graphics Specifications
Integrated Graphics No
Intel® HD Graphics No
Intel® HD Graphics with Dynamic Frequency No
Intel® Quick Sync Video No
Intel® InTRU™ 3D Technology, No
Intel® Flexible Display Interface (Intel® FDI) No
Intel® Clear Video HD Technology No
Expansion Options
PCI Express Revision 2.0
# of PCI Express Ports 2
Package Specifications
Max CPU Configuration 1
TCASE 69.1°C
Package Size 37.5mm x 37.5mm
Sockets Supported LGA1155
Halogen Free Options Available Yes
Advanced Technologies
Intel® Turbo Boost Technology 2.0
Intel® Hyper-Threading Technology No
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® Trusted Execution Technology Yes
AES New Instructions Yes
Intel® 64 Yes
Idle States Yes
Intel® Demand Based Switching Yes
Thermal Monitoring Technologies Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Execute Disable Bit Yes
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Launch Date Q2'11
Processor Number E3-1275
# of Cores 4
# of Threads 8
Clock Speed 3.4 GHz
Max Turbo Frequency 3.8 GHz
Intel® Smart Cache 8 MB
Bus/Core Ratio 3.4
DMI 5 GT/s
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX
Embedded Options Available Yes
Lithography 32 nm
Max TDP 95 W
Memory Specifications
Max Memory Size
(dependent on memory type) 32 GB
Memory Types DDR3-1066/1333
# of Memory Channels 2
Max Memory Bandwidth 21 GB/s
ECC Memory Supported Yes
Graphics Specifications
Integrated Graphics Yes
Intel® HD Graphics Yes
Intel® HD Graphics with Dynamic Frequency Yes
Graphics Base Frequency 850 MHz
Graphics Max Dynamic Frequency 1.35 GHz
Intel® Quick Sync Video Yes
Intel® InTRU™ 3D Technology, Yes
Intel® Flexible Display Interface (Intel® FDI) Yes
Intel® Clear Video HD Technology Yes
Dual Display Capable Yes
Expansion Options
PCI Express Revision 2.0
# of PCI Express Ports 2
Package Specifications
Max CPU Configuration 1
TCASE 72.6°C
Package Size 37.5mm x 37.5mm
Sockets Supported LGA1155
Halogen Free Options Available Yes
Advanced Technologies
Intel® Turbo Boost Technology 2.0
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® Trusted Execution Technology Yes
AES New Instructions Yes
Intel® 64 Yes
Idle States Yes
Intel® Demand Based Switching Yes
Thermal Monitoring Technologies Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Execute Disable Bit Yes
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Launch Date Q2'11
Processor Number E3-1240
# of Cores 4
# of Threads 8
Clock Speed 3.3 GHz
Max Turbo Frequency 3.7 GHz
Intel® Smart Cache 8 MB
Bus/Core Ratio 33
DMI 5 GT/s
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX
Embedded Options Available No
Lithography 32 nm
Max TDP 80 W
Memory Specifications
Max Memory Size
(dependent on memory type) 32 GB
Memory Types DDR3-1066/1333
# of Memory Channels 2
Max Memory Bandwidth 21 GB/s
ECC Memory Supported Yes
Graphics Specifications
Integrated Graphics No
Intel® HD Graphics No
Intel® HD Graphics with Dynamic Frequency No
Intel® Quick Sync Video No
Intel® InTRU™ 3D Technology, No
Intel® Flexible Display Interface (Intel® FDI) No
Intel® Clear Video HD Technology No
Expansion Options
PCI Express Revision 2.0
# of PCI Express Ports 2
Package Specifications
Max CPU Configuration 1
TCASE 69.1°C
Package Size 37.5mm x 37.5mm
Sockets Supported LGA1155
Halogen Free Options Available Yes
Advanced Technologies
Intel® Turbo Boost Technology 2.0
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® Trusted Execution Technology Yes
AES New Instructions Yes
Intel® 64 Yes
Idle States Yes
Intel® Demand Based Switching Yes
Thermal Monitoring Technologies Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Execute Disable Bit
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Launch Date Q2'11
Processor Number E3-1245
# of Cores 4
# of Threads 8
Clock Speed 3.3 GHz
Max Turbo Frequency 3.7 GHz
Intel® Smart Cache 8 MB
Bus/Core Ratio 33
DMI 5 GT/s
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX
Embedded Options Available No
Lithography 32 nm
Max TDP 95 W
Tray 1ku Budgetary Price $262.00
Memory Specifications
Max Memory Size
(dependent on memory type) 32 GB
Memory Types DDR3-1066/1333
# of Memory Channels 2
Max Memory Bandwidth 21 GB/s
ECC Memory Supported Yes
Graphics Specifications
Integrated Graphics Yes
Intel® HD Graphics Yes
Intel® HD Graphics with Dynamic Frequency Yes
Graphics Base Frequency 850 MHz
Graphics Max Dynamic Frequency 1.35 GHz
Intel® Quick Sync Video Yes
Intel® InTRU™ 3D Technology, Yes
Intel® Flexible Display Interface (Intel® FDI) Yes
Intel® Clear Video HD Technology Yes
Dual Display Capable Yes
Expansion Options
PCI Express Revision 2.0
# of PCI Express Ports 2
Package Specifications
Max CPU Configuration 1
TCASE 72.6°C
Package Size 37.5mm x 37.5mm
Sockets Supported LGA1155
Halogen Free Options Available Yes
Advanced Technologies
Intel® Turbo Boost Technology 2.0
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® Trusted Execution Technology Yes
AES New Instructions Yes
Intel® 64 Yes
Idle States Yes
Intel® Demand Based Switching Yes
Thermal Monitoring Technologies Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Execute Disable Bit Yes
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Launch Date Q2'11
Processor Number E3-1280
# of Cores 4
# of Threads 8
Clock Speed 3.5 GHz
Max Turbo Frequency 3.9 GHz
Intel® Smart Cache 8 MB
Bus/Core Ratio 35
DMI 5 GT/s
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX
Embedded Options Available No
Lithography 32 nm
Max TDP 95 W
Memory Specifications
Max Memory Size
(dependent on memory type) 32 GB
Memory Types DDR3-1066/1333
# of Memory Channels 2
Max Memory Bandwidth 21 GB/s
ECC Memory Supported Yes
Graphics Specifications
Integrated Graphics No
Intel® HD Graphics No
Intel® HD Graphics with Dynamic Frequency No
Intel® Quick Sync Video No
Intel® InTRU™ 3D Technology, No
Intel® Flexible Display Interface (Intel® FDI) No
Intel® Clear Video HD Technology No
Expansion Options
PCI Express Revision 2.0
# of PCI Express Ports 2
Package Specifications
Max CPU Configuration 1
TCASE 73.6°C
Package Size 37.5mm x 37.5mm
Sockets Supported LGA1155
Halogen Free Options Available Yes
Advanced Technologies
Intel® Turbo Boost Technology 2.0
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® Trusted Execution Technology Yes
AES New Instructions Yes
Intel® 64 Yes
Idle States Yes
Intel® Demand Based Switching Yes
Thermal Monitoring Technologies Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Execute Disable Bit Yes
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Launch Date Q2'11
Processor Number E3-1230
# of Cores 4
# of Threads 8
Clock Speed 3.2 GHz
Max Turbo Frequency 3.6 GHz
Intel® Smart Cache 8 MB
Bus/Core Ratio 32
DMI 5 GT/s
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX
Embedded Options Available No
Lithography 32 nm
Max TDP 80 W
Memory Specifications
Max Memory Size
(dependent on memory type) 32 GB
Memory Types DDR3-1066/1333
# of Memory Channels 2
Max Memory Bandwidth 21 GB/s
ECC Memory Supported Yes
Graphics Specifications
Integrated Graphics No
Intel® HD Graphics No
Intel® HD Graphics with Dynamic Frequency No
Intel® Quick Sync Video No
Intel® InTRU™ 3D Technology, No
Intel® Flexible Display Interface (Intel® FDI) No
Intel® Clear Video HD Technology No
Expansion Options
PCI Express Revision 2.0
# of PCI Express Ports 2
Package Specifications
Max CPU Configuration 1
TCASE 69.1°C
Package Size 37.5mm x 37.5mm
Sockets Supported LGA1155
Halogen Free Options Available Yes
Advanced Technologies
Intel® Turbo Boost Technology 2.0
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® Trusted Execution Technology Yes
AES New Instructions Yes
Intel® 64 Yes
Idle States Yes
Intel® Demand Based Switching Yes
Thermal Monitoring Technologies Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Execute Disable Bit Yes
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Launch Date Q2'11
Processor Number E3-1235
# of Cores 4
# of Threads 8
Clock Speed 3.2 GHz
Max Turbo Frequency 3.6 GHz
Intel® Smart Cache 8 MB
Bus/Core Ratio 32
DMI 5 GT/s
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX
Embedded Options Available No
Lithography 32 nm
Max TDP 95 W
Memory Specifications
Max Memory Size
(dependent on memory type) 32 GB
Memory Types DDR3-1066/1333
# of Memory Channels 2
Max Memory Bandwidth 21 GB/s
ECC Memory Supported Yes
Graphics Specifications
Integrated Graphics Yes
Intel® HD Graphics Yes
Intel® HD Graphics with Dynamic Frequency Yes
Graphics Base Frequency 850 MHz
Graphics Max Dynamic Frequency 1.35 GHz
Intel® Quick Sync Video Yes
Intel® InTRU™ 3D Technology, Yes
Intel® Flexible Display Interface (Intel® FDI) Yes
Intel® Clear Video HD Technology Yes
Dual Display Capable Yes
Expansion Options
PCI Express Revision 2.0
# of PCI Express Ports 2
Package Specifications
Max CPU Configuration 1
TCASE 72.6°C
Package Size 37.5mm x 37.5mm
Sockets Supported LGA1155
Halogen Free Options Available Yes
Advanced Technologies
Intel® Turbo Boost Technology 2.0
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® Trusted Execution Technology Yes
AES New Instructions Yes
Intel® 64 Yes
Idle States Yes
Intel® Demand Based Switching Yes
Thermal Monitoring Technologies Yes
Intel® Fast Memory Access Yes
Intel® Flex Memory Access Yes
Execute Disable
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IBM BladeCenter™ HS22
Processor Intel Xeon 5500 Series (Dual and Quad Core)
Intel Xeon 5600 Series (Quad Core and Six Core)
Form Factor Single Wide Blade
L2 Cache 4MB / 8MB (Model Dependant)
SMP Dual Socket with Dual Core and Quad Core Models
Chip Set Intel
Memory PC3-10600 CL9 ECC DDR3 1333MHz Chipkill VLP RDIMM 96GB Maximum using 8GB Dimms
Graphics Matrox G200e in on board Integrated Management Module
Cooling System Calibrated Vectored Cooling via chassis
Disk Bays Type Hot Swap 2.5" SAS / SATA / SSD, Quantity: 2 , Max Capacity 600 GB / 600 GB / 100GB
Slots One CIOv and one CFFh expansion connectors per blade server (2/2)
Network Interface Dual Integrated Gb with TOE Broadcom 5709S
Controller Integrated SAS / SATA controller
HDD Controller Integrated LSI1064e with RAID 0,1,1E Optional ServerRAID MR10ie with RAID 0, 1, 10, 5, 50,6, 60
Software and Tools IBM Systems Director shipped as standard. ToolCentre for deployment, updating, diagnostics and configuration assistance.
Dimensions 245mm x 435mm x 29mm
Weight 5.4 Kg (depending on the configuration when options are added)
Security features Trusted Platform Module 1.2
Operating Systems ibm.com/servers/eserver/serverproven/compat/us/nos/ematrix.shtml
Systems Mngmt On Blade Integrated Management Module providing remote presence. IBM Systems Director ships as standard. Additional licenses for non IBM hardware available at an extra cost.
Support IBM HelpCenter with Optional service pack upgrade
Warranty Three years on site limited warranty
Keyboard/Pointing Device No keyboard or mouse shipping with system unit.
IBM BladeCenter HS22 - http://www-03.ibm.com/systems/bladecenter/hardware/servers/hs22/index.html
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Processor Number E5603
# of Cores 4
Socket 1366
Clock Speed 1.6 GHz
Intel® Smart Cache 4 MB
Intel® QPI Speed 4.8 GT/s
# of QPI Links 2
Instruction Set 64-bit
Embedded
Supplemental SKU
Lithography 45 nm
Max TDP 80 W
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* Technické detaily
Source data-sheet: ICEcat.biz
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* Technické detaily
Source data-sheet: ICEcat.biz
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* Technické detaily
Source data-sheet: ICEcat.biz
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* Technické detaily
Source data-sheet: ICEcat.biz
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* Technické detaily
Source data-sheet: ICEcat.biz
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* Technické detaily
Source data-sheet: ICEcat.biz
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* Technické detaily
Source data-sheet: ICEcat.biz
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* Procesor
Socket procesoru: Socket 1366
Krabice: Ne
L2 cache: 4 MB
Frekvence: 2260 MHz
Typ: Intel Xeon
Frekvence zběrnice (FSB): 800 MHz
Model: E5507
CPU operating modes: 64-bit
* Technické detaily
Processor number of cores: 4
Source data-sheet: ICEcat.biz
* Napájení
Dosah napětí VID: 0.75 - 1.35 V
Thermal power: 80 W
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Intel® Xeon® processor E5506 (4C/4T, 2.13 GHz, Second level cache: 4 x 256 KB, TLC: 4 MB, Turbo: No, 4.8 GT/s, Mem bus: 800 MHz, 80 W) inkl. heatsink
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ED O/N HP O/N ORDER ACK SHIP SHIPPED ARRIVED LO COMMENT (03.08.10)
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2110017484 CCW026555001 1 1 1 25.07.2010 30.07.2010 Shipped
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Processor Number W3530
# of Cores 4
# of Threads 8
Clock Speed 2.8 GHz
Max Turbo Frequency 3.06 GHz
Intel® Smart Cache 8 MB
Bus/Core Ratio 21
Intel® QPI Speed 4.8 GT/s
# of QPI Links 1
Instruction Set 64-bit
Instruction Set Extensions SSE4.2
Embedded Options Available No
Supplemental SKU No
Lithography 45 nm
Max TDP 130 W
VID Voltage Range 0.800V-1.375V
Memory Specifications
Max Memory Size
(dependent on memory type) 24 GB
Memory Types DDR3-800/1066
# of Memory Channels 3
Max Memory Bandwidth 25.6 GB/s
Physical Address Extensions 36-bit
ECC Memory Supported Yes
Graphics Specifications
Integrated Graphics No
Package Specifications
Max CPU Configuration 1
TCASE 67.9°C
Package Size 42.5mm x 45.0mm
Processing Die Size 263 mm2
# of Processing Die Transistors 731 million
Sockets Supported FCLGA1366
Halogen Free Options Available Yes
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Originální P/N BX80614X5650 907463 Název produktu Quad-Core Intel Xeon X5650 2.66GHz (x6) 12M, 6.4 GT/sec, LGA1366, BOX Výrobce Intel Třída produktu Procesory Typ procesoru Xeon /Six-Core/ Kód procesoru X5650 Typ patice procesoru LGA1366 Taktovací frekvence procesoru 2.66 GHz Frekvence sběrnice QPI/DMI 6.4 GT/s Velikost cache paměti [L3] 12 MB Podpora technologie Hyper-Threading Ano Integrovaná grafika Ne Doplňující informace 6-jádrový procesor 95W 32nm Intel Turbo Boost Technology - 3.06 GHz BOX Přiložený ventilátor Ne Další informace www.intel.com [LINK]
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ED O/N HP O/N ORDER ACK SHIP SHIPPED ARRIVED LO COMMENT (29.03.11)
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2111009226 CCW166223001 2 2 2 26.03.2011 30.03.2011 Shipped
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ED O/N HP O/N ORDER ACK SHIP SHIPPED ARRIVED LO COMMENT (27.08.10)
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2110021036 CCW045569001 2 2 2 23.08.2010 28.08.2010 Shipped
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