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Specifications
Application
CPU AMD® Dual-Core Socket F 1207 4.1" Mounting Pitch for 1U server
Technical Data
Overall dimension 115.3 X 77.0 X 27.0 mm
Weight 445 g
Heat Sink
Material Copper
Fan
Dimension 70 x 70 x 15 mm
Speed 6000 rpm
Bearing 2xBall
Rated Voltage 12 V
Power 8.76 W
Air Flow 14.16 cfm
Noise Level 53.56 dBA
Air Pressure 1.809 inch-H2O
Lead Wire Pin Out Pin1-Black (-)
Pin2-Red (+)
Pin3-Techometer/Signal output
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Specifications
Application
Socket G34
CPU AMD® Opteron™ 6000 Series up to 115 Watts
Technical Data
Overall dimension 115.3 x 72.0 x 65.5 mm
Weight 680 ± 5 g
Heat Sink
Material Copper Heatsink
Fan
Dimension 60 x 60 x 25 mm
Speed
At Duty Cycle 0~20%: 1700 RPM
At Duty Cycle 50%: 4000 RPM
At Duty Cycle 100%: 8000 RPM
Bearing 2xBall
Rated Voltage 12 V
Power
At Duty Cycle 0~20%: 0.6 W
At Duty Cycle 50%: 1.28 W
At Duty Cycle 100%: 7.2 W
Air Flow
At Duty Cycle 0~20%: 8.75 CFM
At Duty Cycle 50%: 21.88 CFM
At Duty Cycle 100%: 43.75 CFM
Noise Level
At Duty Cycle 0~20%: 16.85 dBA
At Duty Cycle 50%: 35.95 dBA
At Duty Cycle 100%: 51.0 dBA
Air Pressure
At Duty Cycle 0~20%: 0.708 mm-H2O
At Duty Cycle 50%: 4.425 mm-H2O
At Duty Cycle 100%: 17.701mm-H2O
Lead Wire Pin Out Pin1-Black (-)
Pin2-Yellow (+)
Pin3-Green (Tachometer/Signal output)
Pin4-Blue (PWM)
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Specifications
Application
CPU Intel® Xeon™ 5500/5600 Series Processor Socket LGA 1366 for 1U Server
Technical Data
Overall dimension 90.0 x 90.0 x 27.7 mm
Weight 475 G
Heat Sink
Material Copper Heatsink
Fan
Dimension 70x70x16 mm
Speed At Duty Cycle 0%: 1100 rpm
At Duty Cycle 20%: 1100 rpm
At Duty Cycle 100%: 6000 rpm
Bearing 2xBall
Rated Voltage 12 V
Power
At Duty Cycle 0%: 0.6 W
At Duty Cycle 20%: 0.6W
At Duty Cycle 100%: 8.76 W
Air Flow
At Duty Cycle 0%: 2.45cfm
At Duty Cycle 20%: 2.45 cfm
At Duty Cycle 100%: 14.32 cfm
Noise Level
At Duty Cycle 0%: 19.1 dBA
At Duty Cycle 20%: 19.1 dBA
At Duty Cycle 100%: 53.8 dBA
Air Pressure * inch-H2O
Lead Wire Pin Out Pin1-Black (-)
Pin2-Yellow (+)
Pin3-Green (Techometer/Signal output)
Pin4-Blue (PWM)
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SUPERMICRO 2U-4U passive heatsink s1366
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Originální P/N BXSTS100C 900491 Název produktu Boxed Intel® Thermal Solution STS100C (Passive/Active) Výrobce Intel Třída produktu Chlazení procesoru Materiál pasivu Hliník / měď Typ ložiska nedostatek dat Typ patice procesoru LGA1366 Typ procesoru Xeon /Quad-Core/ Další vlastnosti Chladič určený pro procesory Intel Xeon série 5500 Další informace www.intel.com [LINK]
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Originální P/N BXSTS100P 900492 Název produktu Boxed Intel® Thermal Solution STS100P (Passive) Výrobce Intel Třída produktu Chlazení procesoru Materiál pasivu Hliník / měď Typ ložiska není instalováno Typ patice procesoru LGA1366 Typ procesoru Xeon /Quad-Core/ Další vlastnosti Chladič určený pro procesory Intel Xeon série 5500 Další informace www.intel.com [LINK]
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Originální P/N BXSTS100A 900490 Název produktu Boxed Intel® Thermal Solution STS100A (Active) Výrobce Intel Třída produktu Chlazení procesoru Materiál pasivu Hliník / měď Typ ložiska nedostatek dat Typ patice procesoru LGA1366 Typ procesoru Xeon /Quad-Core/ Další vlastnosti Chladič určený pro procesory Intel Xeon série 5500 Další informace www.intel.com [LINK]
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SUPERMICRO 2U-4U passive heatsink s1366
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Pedestal chassis that provide adequate ventilation and correct temperature 80 W air to the thermal solution.
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Pedestal chassis that provide adequate ventilation and correct temperature 130W air to the thermal solution.
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SUPERMICRO 1U passive heatsink s1156
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SUPERMICRO 4U active/passive heatsink s1366
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SUPERMICRO 1U passive heatsink s1366
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SUPERMICRO 2U-4U passive heatsink s1366
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SUPERMICRO 2U passive heatsink Xeon (667/1066/1333)
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1U passive heatsink Intel socket 775
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2U+ MP Server
LGA 1567
Xeon Processor 7500 série
Xeon E7-4800 série
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SUPERMICRO 3U+, Active Heatsink, AMD Socket F CPU
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1U, Passive Heatsink, PD and PD+ Processor (INTEL)
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1U, 2U, or blade chassis that provide ducted airflow to the thermal solution 95W
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SUPERMICRO 2U passive heatsink Xeon (667/1066/1333)
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